mutantsushi said: Is ESRAM or whatever Xbone uses amenable to 3d FinFET process? Doing that WILL likely strongely invoke the issues people had with PS4NEO announcement, I kind of suspect MS will go that way, and since they're breaking trivial BC anyways, |
Can't see why they can't put the ESRAM on the chip. Though it risks taking up space on the die which in turn limits how much else they can put on it like what hapoened to them with the ogXB1. But on a plus side they can now put a lot more of it, maybe 64MB or even 128MB and at an even higher bandwidth. This is the most effective way they can ensure BC with all existing XB1 games out already and ensure FC and BC going forward.
Another option would be to go with somwthing likE GDDR5x ram. That if clocked right could give them upwards of 300GB/s+ in bandwidth. With that kinda margin they could emulate the ESRAM allowing full BC. Only problem with that is going forward that would make it seem like the XB is made up of two entirely different platforms as opposed to one platform with two graphical presets.
For these mid gen cycles to work, full BC is the single most important thing. It so inoortant that its not even considered as BC, its just scalability. Maybe there is something about the UWP that makes this all work.... maybe.