the company that makes the heatsinks for the ps3's announced about two months ago that the prototype heatsink for the new 45nm equippd ps3's was 33% smaller than the current heatsinks.
(I haven't been able to find the link to their press release again)
this is the current heatsink
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If they also take out the psu and have it be in external brick form like the 360's psu that will greatly reduce the size.
And given that the main board has already been compacted with the removal of components in the 40 gb version a slim ps3 can't be to far behind.








