| edugamer said: The RROD wasn't really MS' fault. Blame the EU for mandating lead-free solder and the solder companies screwing the pooch on the replacements. PS3 had the same problem with the YLOD |
It's not a mission impossible to comply with lead-free solder rules without producing unreliable junk, the only three things needed to avoid that the higher brittleness of some lead-free alloys actually create problems are a more careful soldering process, PCB design that reduce heat strain and a more careful design of the cooling system, not to dissipate more heat, just making the temperature more uniform, or at least changing less sharply across the PCB is enough. Obviously high power consumption chips and crammed cases make it more difficult, and this is where rushing a release can create problems as usually the earlier you produce, the higher power consumption is needed to obtain the desired computing power.
