Xbox One will detect heat, power down to avoid meltdown

[Pemalite]

 

 

superchunk said:

endimion said:

superchunk said:
So it will have a fail safe mode.

Something that should be standard by now I'd think.

Well, at least they've learned some very real lessons from RROD.
- much larger casing/room to vent heat
- much better design/raw components for this type of box
- much better approach to keeping it from actually breaking (this fail safe mode)

I seriously doubt Xbone will have to 30%+ failure rate original X360 had.

once again on board components didn't fail on 360 and certainly didn't fail because of heat... the heat was desoldering them from the board....  and they corrected that on 360 already.... so unless they decide for some obscure reasons to go back to the old soldering method.... there is no worries to have, they've always done an excellent work at venting the components.... the issue wasn't there

So it took them multiple years and had to wait for the size of the chip fabrication move to a smaller nm all because the soldering was wrong? Seems like if you are in any form correct, that would have been fixed in manufacturing very early on.

I mean first redesign had smaller nm and it went from 30%+ defect rate to a more normalized level and then another redesign to make it near perfect. However both accompanied smaller fab processes which focus on reduction in overall heat as well as power usage (and of course per item costs).

Fact is, it failed A LOT all due to poor design and this time around the impression is that everything is being done to ensure there is no repeating those mistakes.

The guy is right, the solder was the main culprit.
Usually when you solder something onto a PCB you use a Lead-based-solder which has a fairly high melting point and doesn't get metal fatigue.
However, the Xbox 360 used a type of lead-free solder, which would crack thus causing failures.

A direct cause of the problem was heat, you lower the heat either by making the processors on a smaller fabrication process or throw in better cooling, both of which would help prevent the lead-free solder from cracking.

This is why the "towl" trick worked for allot of people as essentially it allows the console to get hot enough to cause the solder to become soft and fix the cracks itself.

So the cause is heat, the problem was the solder and it's the greenies over in Europe that pushed for that change.