superchunk said:
So it took them multiple years and had to wait for the size of the chip fabrication move to a smaller nm all because the soldering was wrong? Seems like if you are in any form correct, that would have been fixed in manufacturing very early on. I mean first redesign had smaller nm and it went from 30%+ defect rate to a more normalized level and then another redesign to make it near perfect. However both accompanied smaller fab processes which focus on reduction in overall heat as well as power usage (and of course per item costs). Fact is, it failed A LOT all due to poor design and this time around the impression is that everything is being done to ensure there is no repeating those mistakes. |
at least every report and news and anything remotely official or unofficial back then were pointing at that issue being the reason for failure.... and that is why it was easily fixable at home with the right tools... now I'm no psychic .... heat was responsible but not by destroying the chips... of course you had some failures probably there too.... I never had a RRoD personally, but I did buy a RRoD fix kit once my warranty ran out and fixed several of my friends that were out of warranty.... haven't seen a single one burn out.... heat was either warping the board which in turn made the soldering give way or directly the heat was affecting those soldering....
but the chip was fine.... that's the main reason the towel trick came up... it basically heated up the soldering and would in some cases get things back to normal....
like you said it was a major design flaw but not a chip flaw.... so yeah smaller chips=less heat= less warping=less constraints on the soldering... and I don't know where you have seen it took 3 years to fix it... the major issue for it lasting long was inventory in stores that had to be sold....
but who cares lets put the issue to rest and make it a bad memory nothing more.... lets talk about the future and how cool (literally) and quiet the Bone will be :)
