endimion on 15 August 2013
| superchunk said: So it will have a fail safe mode. Something that should be standard by now I'd think. Well, at least they've learned some very real lessons from RROD. - much larger casing/room to vent heat - much better design/raw components for this type of box - much better approach to keeping it from actually breaking (this fail safe mode) I seriously doubt Xbone will have to 30%+ failure rate original X360 had. |
once again on board components didn't fail on 360 and certainly didn't fail because of heat... the heat was desoldering them from the board.... and they corrected that on 360 already.... so unless they decide for some obscure reasons to go back to the old soldering method.... there is no worries to have, they've always done an excellent work at venting the components.... the issue wasn't there
