drkohler said:
I think it is pretty agreed upon that the horribly bad cooling design in the original X360 lead to rrod (the lf solder didn't really matter in the end, it would have backfired with any solder). Basically, if I remember correctly, it was the cooling fan position that killed it (the original XBox had the fan right next to the major heat source, the original XBox360 maintained the fan position but had the heat source moved away too far from it, which caused almost immediate overheating. |
I've seen every cooling mod going done to try and prevent RROD, none worked because that wasn't the core of the problem. The biggest issue is the board warps as it goes through heat cycles, the poorer quality of lead free solder meant the joints broke quicker, this is proven by the fact that when the chips were reballed with leaded solder the issues were vastly reduced (only 3rd parties obviously as Microsoft weren't allowed to do that). A thicker board wouldn't have warped to the same extent and there for allowed more tolerance. Its clear that the GPU seperating from the board due to warping was a concern which is why Microsoft took to gluing the chips in an effort to minimize flexing.
