did you read the engdaget parts which is the only verified part here.... apparently they've been toying with various hardware design.... so I bet what they asked to devs (if they did) were all question they have tested already....
and looking at the small production knowledge I have with more technical hardware (use to work for a company doing scientific equipment that needed calibration and was working with a smaller manufacturer than MS has more than likely) those Chinese manufacturer can output a shit load of stuff a day.... they could be close to 1 million units produce by launch if they start soon if not more.... after all they started in august for XB360 and released in November
so production is not the issue here.... and apparently R&D neither....
not saying this is true.... but one thing for sure it's feasible especially since it's just ram we are talking about.... those are soldered by automated production unit.... takes less than 10 second to do....
the real question is do they have the motherboard ready to do it and/or the ram available for production... the bottleneck if one exist and this rumor is true will be on the component manufacturer side....
