Further evidence that MS is potentially having hardware issues in cooling.

[Solid-Stark]

ethomaz said:

Solid-Stark said:

Chris Hu said:

It should be a lot smaller with the first redesign especially if they skip the 22nm process (which they really should) and wait for 14nm chips for the first redesign.

It's not clear whether the PS4/XbOne APU chips are 32nm or 28nm. Currently, signs point to a 32nm fab proccess. This is a solid conjecture by Superchunk.

AMD will be moving to 28nm for Steamroller Q4 2013/Q1 2014, and then to 22nm or 20nm for Excavator sometime in 2015. Going from current 32nm (or 28nm which wouldn't help the case in point) to 22nm or 20nm in two years wouldn't enable a drastic slimmer redesign. It's not like PS360 going from 90nm to 45nm(and 40nm for PS3 RSX) which enabled slimmer designs.  Again, Superchunk may be on to something.

For reference, Intel will be on 14nm fab process second half next year with Broadwell, and AMD will be in 22nm or 20nm for Excavator sometime in 2015. It's not clear (or been discussed by AMD) where they will be after Excavator. We will have to wait till after Excavator (2015 or later) to see a drastically slimmer XbOne if it comes down to components and these poor yield and over heating issues are true. However, I suppose Microsoft can do some reworkings when it comes to cooling for the current chipset (again assuming this rumors are true.)

AMD APUs are made with 28nm... AMD already stated that.

22nm only Intel can do right now... AMD have still one year or more to move to massive 22nm production...

Below that neither Intel is working yet... 20nm is planned to 2015... and 14nm we won't see this console generation.

Great.

Well there goes a better picture.

I had understood Broadwell was going to be 14nm sometime late next year. My mistake.