By using this site, you agree to our Privacy Policy and our Terms of Use. Close
Netyaroze on 22 April 2013
Edit Thread
Jadedx said:


8 core 24cu(large)

360soc (small)

2x4gb hmc(less space than current 360 ram set up)

less power needed to power each item, less connectors needed, less heat produced since they do not all need to be running at once.

As for the price: Having both apus on one soc would mean 1 chip at a fixed cost instead of multiple chips at varying costs, same reason ms did this with the 360. HMC ram is not going to be as cheap as ddr3 but it will not be that expensive considering that it is only normal ddr3 chips with tsvs and a controller. And the 360 soc was cheap when it came out 3 years ago, I doubt it costs that much to make now.

This solution has less chips than the original ps3 and is similar to the yukon leak, which ms thought would cost around 225 w/ 4gb of ddr4.

 

My prediction is that the system will have all of this, be the same size as og 360, come with kinect 2, and cost them a total of 345- 360 after packaging and shipping. and they will sell it for 399.99


So you say 8 Core 24 CU ? Thats not two APUs thats one big APU One rumored Xbox APU has 8 Core 12 CUs so two APUs have 16 Cores and 24 CUs.

 

 

Putting two seperat APUs on one SOC makes no sense. If both APUs are on the same wafer why not just design a big APU with more efficency instead and twice the Cores/CUs ? Its pointless to use two APUs unless you have maximized whats possible on a single Wafer and putting two APUs on one Wafer makes even less sense.

 

But nevermind lets just assume 8 Cores 24 CUs.  Thats a huge Chip 500mm2 200 Watt so atleast as big as PS3 was which had two Chips of 235mm2 and 250mm2. The Chip will need good cooling and cost alot to produce. 

 

Hybrid Memory Cube technology is in its infancy just because MS joined the Consortium  doesn't mean 720 will have it.

 

The technology is not even ready its supposed to replace conventional Ram like DDR4. Which is not even out yet. Thats future stuff not something that can be mass produced right now.

 

Its absolutely unthinkable this kind of technology comes soon anywhere. 

 

So basically GDDR5 is the only option MS has right now to get the necessary bandwith to utilize 24 CUs. If its indeed an 8gb GDDR5 8 Core/ 24 cu machine. Its basically a PS4 on steroids and obviously costlier to produce and bigger aswell.  I think its still possible to do that though. 

But no HMC also Dual APUs make only sense if it was a quick fix because it wastes computing power to use Crossfire Setups. And has literally no advantages (just disadvantages) compared to a bigger chip.