drkohler said:
This is an error most people make. Actually, the situation is exactly opposite of what you think. A 14nm APU might dissipate only 60% of the heat of a 28nm APU (assuming leakage problems can be solved which greatly increase as the process scale decreases) . However the heat density is now much higher, because the die size of the 14nm APU is considerably smaller than the 28nm APU. Cooling becomes more critical the smaller the die surface is, because you have "less surface area to dissipate heat". |
Hmm I always thought heat would go down roughly lineary with die size. Interesting, Still the overall heat goes down even if they need to spread the heat properly since its concentrated more. Appearently it must be possible to stack ram and spread the heat or else stacking couldn't be done.
I see the problems better now, thanks for clearing that up. I trust engineers to find a cost efficent solution in time for a PS4 redesign to make sense. These consoles will be around for a while I guess.
Which is why I wrote this in my first post:
"and if stacked ram becomes reality we can look forward to a smaller quiter cheaper PS4."
If Nvidia can, AMD has to do it too or else they won't be able to compete. Nvidias push in that direction looks like a breakthrough was made or is about to be made for the whole Industry. Arent the foundries responsible for it anyway ? So basically available for AMD too ?
