To added... some cost of old CPU to AMD/Intel.
Assuming:
0.002 Defects per mm^2
$4900 per 300mm CMOS Wafer
$5300 per 300mm SOI Wafer
$2700 per 200mm SOI Wafer
alpha of 1
Dies Per Wafer = {[pi * (Wafer Diameter/2) ^ 2] / Die Area} - {[pi * Wafer Diameter] / (2 * Die Area) ^ 1/2}
Yield = (1 + [Defects per Area * Die Area / alpha]) ^ (-alpha)
$10 burning, binning and packaging cost for single die chips
$15 burning, binning and packaging cost for dual die chips
AMD Agena (9XXX):
65nm, 300mm Wafer
285 mm^2 Die
= 203 Dies per Wafer
= 63.69% Yield
= 129 Usable Dies per Wafer
= $41.09 per Die
= $51.09 per Chip
intel Yorkfield (2x 6MB) (Q9XXX):
45nm, 300mm Wafer
2x 107 mm^2 Dies
= 2x 290 Dies per Wafer
= 82.37% Yield
= 2x 238 Usable Dies per Wafer
= $20.52 per 2x Die
= $35.52 per Chip
intel Kentsfield (2x 4MB) (Q6XXX):
65nm, 300mm Wafer
2x 143 mm^2 Dies
= 2x 213 Dies per Wafer
= 77.76% Yield
= 2x 165 Usable Dies per Wafer
= $29.56 per 2x Die
= $44.56 per Chip
AMD Agena (8XXX):
65nm, 300mm Wafer
285 mm^2 Die
= 203 Dies per Wafer
= ~68.68% Yield
= ~139 Usable Dies per Wafer (of which ~133 could be sold as quads)
= ~$38.13 per Die
= ~$48.13 per Chip
AMD Kuma (7XXX):
65nm, 300mm Wafer
~150 mm^2 Die
= ~405 Dies per Wafer
= ~76.92% Yield
= ~312 Usable Dies per Wafer
= ~$17.01 per Die
= ~$27.01 per Chip
AMD Windsor (X2+):
90nm, 200mm Wafer
219 mm^2 Die
= 113 Dies per Wafer
= 69.54% Yield
= 79 Usable Dies per Wafer
= $35.83 per Die
= $45.83 per Chip
intel Wolfdale (6MB) (E8XXX):
45nm, 300mm Wafer
107 mm^2 Die
= 580 Dies per Wafer
= 82.37% Yield
= 477 Usable Dies per Wafer
= $10.26 per Die
= $20.26 per Chip
intel Conroe (4MB) (E6XXX):
65nm, 300mm Wafer
143 mm^2 Die
= 426 Dies per Wafer
= 77.76% Yield
= 331 Usable Dies per Wafer
= $14.78 per Die
= $24.78 per Chip
AMD Brisbane (X2+):
65nm, 300mm Wafer
126 mm^2 Die
= 488 Dies per Wafer
= 79.87% Yield
= 389 Usable Dies per Wafer
= $13.61 per Die
= $23.61 per Chip
intel "Ridgefield" (3MB) (E7XXX):
45nm, 300mm Wafer
~83 mm^2 Die
= ~757 Dies per Wafer
= ~85.76% Yield
= ~649 Usable Dies per Wafer
= ~$7.55 per Die
= ~$17.55 per Chip
intel Alendale (2MB) (E4XXX):
65nm, 300mm Wafer
111 mm^2 Die
= 558 Dies per Wafer
= 81.83% Yield
= 456 Usable Dies per Wafer
= $10.74 per Die
= $20.74 per Chip
AMD Manilla (Sempron):
90nm, 200mm Wafer
126 mm^2 Die
= 201 Dies per Wafer
= 79.87% Yield
= 160 Usable Dies per Wafer
= $16.85 per Die
= $26.12 per Chip
intel Conroe-L (4XX):
65nm, 300mm Wafer
90 mm^2 Die
= 715 Dies per Wafer
= 84.75.76% Yield
= 606 Usable Dies per Wafer
= $8.32 per Die
= $18.32 per Chip
http://www.overclockers.com/forums/showthread.php?t=550542
