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JEMC said:

Actually, if you followed some teardowns, they talk about an extra chip on the MCM.

 

Anandtech wrote this:

"There are actually three components on this single package, made in at least two different microprocessor fabs. The multicore PowerPC based CPU is the smaller of the two larger chips. This die is made on IBM's 45nm SOI process. The RV7xx derived GPU is the biggest die on the package, and I'm presuming it was made on a 40nm process. I'm assuming the very tiny die in the corner is actually some off-chip memory."

Now the question is, what does that tiny die do?


While you're right, all signs point to this chip being used in the same format as it was in Wii. i.e. not as a dual cpu.