Wii U vs PS4 vs Xbox One FULL SPECS (January 24, 2014)

[JEMC]

HoloDust said:

drkohler said:

Remember that the 156mm^2 is a superficial number. These guys measured the chip carrier dimension, not the die size. (the "real" die is protected inside the ceramic carrier). Usually there is a (sometimes quite large) safe area around the border of the carrier. People may also not count the pad area on the die. Die size of the GPU probably is in the <120mm^2 range (unless they really risk it).

Thanks for clarification - I was leaning toward Redwood (it's 104mm^2 @40nm), but now I''m thinking they might've gone with 6550D - I think that's pretty much the same chip, just shrank to 32nm, and put into their A8 APUs.

Not likely.

AMD have said that WiiU's GPU was a 40nm one, and only GloFo (that I know) had gone with the 32nm with the whole GPU chips industry (basically TSMC) skipped the 32nm process and went straigh from 40 to 28nm.