ethomaz on 18 November 2012
"There are actually three components on this single package, made in at least two different microprocessor fabs. The multicore PowerPC based CPU is the smaller of the two larger chips. This die is made on IBM's 45nm SOI process. The RV7xx derived GPU is the biggest die on the package, and I'm presuming it was made on a 40nm process. I'm assuming the very tiny die in the corner is actually some off-chip memory. Both the CPU and GPU in the Wii U are supposed to have some eDRAM, although the bulk of it is likely dedicated for the GPU.
If we assume a 40nm process for the GPU, then we're looking at something a bit larger than the RV740."
