Did the Wii U force Sony to cut how much power the PS4 will have?

[joeorc]

current CTO of Hardware development  over@ Sony Computer Entertainment already stated what type of design their doing 3D stacked chips for the PS4

the PSVita already uses Stacked Chips

http://www.i-micronews.com/news/Sony-wide-IO-memory-Playstation-Vita,9334.html

 

It appears that Sony is once again a “3DIC” leader showing that wide IO memory can be used without having to introduce HVM TSV technology which most assuredly, at this point in 3DIC evolution, would have been a costlier option which would have taken significantly longer to implement.

Earlier this year Masaaki Tsuruta, CTO of Sony Computer Entertainment, indicated that there will likely be a 3D stack incorporating TSV technology in the next generation console. Sony's target of no more than 50ms latency even for 8k x 4k resolution at 300fps, clearly points to the need for a highly integrated TSV-based package although Tsuruta warned "We will have to work with a lot of third-party partners to make these things happen."

Sony plans to use TSV for its next gaming station CPU/GPU

 

Sony Computer Entertainment is planning on a much longer shelf life for its next generation PlayStation gaming console with a strategy that appears to be based around refreshing the platform over its lifetime with a series of high profile, cutting edge technology including TSV interconnects base packaging.

Masaaki Tsuruta, CTO of Sony Computer Entertainment, says that the company is working on a system-on-chip (SoC) to underpin the product for "seven to 10 years". The PlayStation 3 will be at least seven years old by the time its successor arrives, but is generally considered to have lasted longer than was originally expected. A firm launch for the fourth generation console - not to be called PlayStation 4 - was pushed out again late last year. Its designed-in longevity is largely a matter of economics. 

The Cell Broadband Engine that powered the PS3 cost $400m to develop; the main SoC for the incoming console is likely to be a 3D stack incorporating thru-silicon-via technology and could be the first $1bn hardware design project. “We have to look at two things,” Tsuruta-san says, “return-on-investment (ROI) and turnaround time (TAT).” The ROI issue, given the further costs of bringing a new PS to market (software, marketing, etc), means that Sony will be looking at a number of years and revs of the machine's insides.

http://www.i-micronews.com/news/Sony-plans-use-TSV-gaming-station-CPU-GPU,8196.html