| haxxiy said: It's not impossible for the PS4 to use Tahiti since GFLOPS/W performance nowadays is some 16:1, so the card itself shouldn't draw more then 130W on full load. At launch both the PS3 and the X360 drew >300W each for the whole system and I don't see the remainder of the Durango/Orbis system making up something even close to that number. Of course it would be easier to use the Pitcairn core but maybe the architecture is gimped in some aspect Tahiti isn't, or maybe Sony discovered it's going to be cheaper to use the bigger chip and have a much greater wield per wafer due to all the cut components. Anyways while maybe there are some fanboy dreams from one side there's also PC supremacists and Ninty fans in the other doing the same job... |
I hope you don't mind if I correct of few of your figures.
The PS3 at launch had a power usage of just 200 watts, not 300 watts.
The HD 7950 has a TDP of 180 watts. The 7970 a whopping 250 watts.
And how in the world would it be cheaper to have a larger die size per wafer? Yeilds with larger dies are always lower. If you can get 80 chips per wafer against only 15 per wafer, which one is goign to yeild the most usable chips? The one with the smaller chips.
| JEMC said: About the bolded, do you think that an HD79xx could be more credible if done with a 22 20nm fab process? That is, if TSMC gets it right this time. After all, the leaked specs are from 2010, when 22/20 nm fab processes where supposed to be mature by 2013. |
No. The law of diminishing returns shows that the drop from 28 nm to 20 nm won't yeild huge gains in thermals.
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