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drkohler said:

And yes, of course XBox Slims had yield problems. The CPU/GPU die was a complete redesign in (32nm which was reasonably new at that time), incorporating two different design philosophies on a singe die. Again, this ultimately was IBMs problem, though, to get enough money from MS to offset the loss for too many required dies.


Actually you seem pretty spot on with everything else, however it is likely 45nm given the timing of release and having to first sample, test then ramp up the chip. The design itself was likely finished in 2009 on the process it was released on and the only process they could use at the time was 45nm.



Tease.