greenmedic88 on 17 June 2011
Smaller die process = smaller chips = less power = smaller/external PSU = less heat = smaller heatsink/fan = smaller casing = cheaper production cost.
Not too difficult to follow.
There will be another significant hardware revision whether it happens sooner or later. Given the last major revision/price drop was in Q3 2009, it's not out of the question that another is due Q3 2011.
