WereKitten on 14 June 2010
ZenfoldorVGI said:
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I'm pretty sure Sensei's was a synecdoche.
As for the heating issues, the big ventilation grid on the side seems to be where I expect them given the "leaked" motherboard pictures we've seen around. And from those pictures there would be an integrated Valhalla package (CPU GPU both at 45nm or less) under a single spreader and dissipator. That's probably lower enough in heat generation to not cause major problems on the new motherboards, unless MS fumbles again in some low-quailty building/assembling trouble.
