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joeorc said:
Twistedpixel said:
joeorc said:
Twistedpixel said:

No its really quite simple.

Every 60GB PS3s solder joints will crack.

Every 60GB PS3s heat spread compound will go dry and brittle and lose effectiveness.

Every 60GB PS3 which is used will die.

no your trying to use a small sample to make it seem like it represent's the status as a whole

that's what is simple:

like I said your are reaching

 

No, what im saying is that almost every PS3 60GB launch model is going to die within a timespan which is within the expected lifespan of the product (6 years). Most 40GBs will die on the same terms as well. This is due to the solder used and the heat compound between the heatsink and the chip being inadequate.

no what you stated was this:

"Early PS3s in the mid term (3-4 years) are about as unreliable as the Xbox 360s. The 60GBs will be very rare by the time the next PS3 launches. It takes them longer to fail but pretty much every single one is doomed due to the heat and the new solder.

 

which

is not true at all.

because if it did, there would have been way more failure rated PS3's and the new's media would have ran a story on it, just like the Bios chip time state software failure.

 

The media doesn't report everything, especially if everyone who gets a broken console considers themselves to be a freak case.



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