greenmedic88 on 24 October 2009
| grimygunz said: i hope so to. the first time i tried to fix it it worked for 4 min the ylod again. this time i used a bit more thermal paste (keeps chips from over heating) and put flux (some liquid chemical that helps the solder on main chips) on the Cell and RSX chips before doing a second reflow. |
More TIM doesn't = better cooling. If anything, too much will cause excess material to squeeze out between the chip and heatsink. You'll see this sometimes with factory jobs in cheaper consumer electronics.
If using a metal particle based TIM, that can actually lead to a short circuit in worst case scenarios if it overflows onto the chip connectors or logicboard.
High quality TIM like Arctic Silver 5 is actually applied by using LESS material than regular pastes, which are correctly applied by using a plastic card to evenly smooth a thin layer of material over the chip surface.
With AS5, you would only use a rice grain sized drop.
