Destroyer_of_knights on 26 August 2009
| jkimball said: DoK: you have a single fan and two items to cool. How do you propose packaging to accomplish this withouth paralellization? the fan pulls hot air from heat sync, and pushes it though a tunnel in the power supply where it picks up more heat and then exits out the back.Noted the seaeld connectione between power supply and the rest of the chasis. I bet you can dry your hair with this sucker! |
the Phat PS3 power supply didn't have a fan nor any any air being blown through it, in fact it sat on the top of the motherboard just next to the BD drive, while the heat sink and fan were located underneath the motherboard.
So knowing this, I just find it odd that they went this parallel method, but like I said, the thermal properties of the power supply must be high enough so that they are not affected by it's own heat nor affected by the extra heat coming from the heart sink, while at the same time maintaining the component life equal to that of the power supply found in the old PS3, which didn't have a fan blowing air through it.
