kn said:
I would have to strongly disagree... Yes, a die shrink of the cell nets more processors per wafer and a lower cost, but a complete redesign and a shrink is expensive. It pays off more in the long run but miniaturization of existing technology is pretty much always MORE expensive in the short run unless the materials that are being saved are precious. I don't think plastic is that pricey, lol. I would think the redesign to a slim would STOP a pricecut from happening until they recoup the redesign costs and then we would see a price cut... |
The PS3's components have already been shrunk rapidly.... they could just be putting a new case around it and moving the PSU outside (thus cutting back on cooling systems).
Here's a comparison image of the launch PS3's mobo and the current one:
It's interesting the note the similarity in the shape of the mobo to the rumoured PS3 Slim design - maybe they haven't had to change much at all. They may have started using a smaller die, for which they'll have to pay the R&D for, but I think it would be more coinciding with the Slim, rather than being done for the Slim, if you get what I mean.
