Xoj said:
a ps3 slim would be built 45nm or even less manufacturing process, smaller chips heat and electricity can be cook by half, sony can get it to the size of a ps2.
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Also (not sure of the correct name) the power box is inside the ps3 , with the ps2 slim they had it on the lead like the 360 does , so if they had the box from inside the ps3 and put it on the lead it would also reduce heating........I think lol







