drkohler said:
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You apparently don't have any clue what you are talking about, either. A 12" wafer can easily hold a crapload of legacy die. I don't know the size of the playstation 2 GSX chip, but the Wii CPU which is easily as more more powerful is 19 square millimeters. Using basic math for the area of a circle, we find the formula pi*r^2 for a 300MM wafer (modern manufacturing is standard on 12" or 300MM) being a total square millimeter surface area of 70,685 MM. Divide 19 into that result and you find approximately 3720 total die. Assume a 90% yield and you get 3348 usable chips from one wafer. $9000 is a good rough estimate of the cost to manufacture a 12" wafer putting the GSX chip at about $3 each in quantity. The cost is so negligble as to prove that Sony cut every possible corner to cut costs and that there are other motives in the move to remove BC completely. Keep in mind, too, that I used the size of the Broadway graphics chip on the Wii as my size estimate. I would be willing to bet that the GSX in the PS2 is smaller still which would mean an even higher yield....
Could it be Sony is trying to increase the attach rate so 3rd parties get back on board? Who knows...








