I just don't think that it's gonna happen. The slimmer design will only happen when the die size of chips gets a lot smaller, i.e in 4-5 years. The sliim design that you are talking about will make the whole thing hotter b/c the whole thing will have the same insides but a more compact design. In fact, I would think that the compactness of the current design that is causing some big-time heating problems.







