@ Geldorn My numbers aren't pure fantasy.
Production costs are charged per wafer not per chip. Assuming yields stay the same of course if you produce twice as many chips on a wafer your per chip cost is halved. This doesn't effect packaging and testing costs of course.
So if your Wafer costs $10,000 and you can produce 100 chips @ 168mm^2 (13mm per side) your cost per chip is $100 assuming 100% yields. This is for the 90nm process node.
Since by all reports I have gathered with unfortunately no specific numbers bar reports that the Xenon die size has halved. If the die size has halved then the actual production costs would have halved at least for the chip component. So your $100 chip now costs $50. (Not taking into account packaging and testing costs which are extra to this)
Also the power requirements have halved, 200w - ~100w, so all the power regulation and supply equipment can be simplified. Im too tired for this...
Tease.
