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wangfoo said:
ceres said:
Well I think a lot of people have agreed that the main problem is the poor soldering that allows the motherboard to warp overtime.

Poor soldering? What? The soldering on the ICs is done by a computer controlled solderer. Its the same type of machine that is used for every manufactured mainboard.

The complaints I have heard are the poor quality of the x-clamps mounting system, which allows for warping and loss of contact with the heatsink.


"Poor soldering" is inaccurate, but refers to the particular type of solder they use, it is lead-free to comply with RoHS, and definitely is less flexible than old lead solder. Also, soldering doesn't cause the board to warp, obviously. The warping of the board combined with inflexible solder material causes the contacts to come loose. Of course, the fact that the solder points on the board come loose is as much a result of overheating due to poor heat dissipation as the poor flexibility of RoHS solder. 

 Blame the environmentalists if you want.