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Forums - Sony - Confirmed: The new 80 gig PS3s have 65nm RSX chips.

obieslut on 14 September 2008

if and when a slim ps3 comes along i will be buying that. then i will have 2 ps3's



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quaiky on 14 September 2008
heruamon said:
45nm? I thought this was coming this year for the PS3?

 

ibm announced they had the cell shrinked to 45nm in feb or march, but sony has not announced yet that the swapped to smaller cells.

there might as well be a problem with starting mass producton with the 45nm SOI process IBM is using for the cell. amd also had to push back the rpoduction start for their 45nm cpus and they are using the same SOI process that they codeveloped with IBM.

Intel is the only big company of which i know that thay are allready massproducing in 45nm but they are using standard silizium wafers and not SOI.



FilaBrasileiro on 14 September 2008
heruamon said:
45nm? I thought this was coming this year for the PS3?

45nm RSX is coming out February next year I think, 45nm Cell is already out I think, I think they are working on the 32nm Cell....

 



Jo21 on 14 September 2008
FilaBrasileiro said:
heruamon said:
45nm? I thought this was coming this year for the PS3?

45nm RSX is coming out February next year I think, 45nm Cell is already out I think, I think they are working on the 32nm Cell....

 

 

yes.

but i guess mass production won't be here til end 2009



chenguo4 on 14 September 2008

Whoa... That site is wicked. In 10 minutes I've learned as much about the PS3 as I've known before.




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HanzoTheRazor on 14 September 2008

This was proven a bit back now, when some tested the power usage between the 40's and new 80's. The new 80's use less power and are a little quieter again.

Bravo to SONY for moving so fast. It took M$ over a year longer to do this!



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cool48 on 14 September 2008

K well as long as it's a good thing I'm happy.



BKK2 on 15 September 2008

They actually already switched to 65nm RSX on later models of the 40Gb (CECHH).

Here's the different mobos up to CECHH (I haven't seen any pictures of new 80Gb mobo yet):

COK-001: CECHA (60Gb), CECHB (20Gb): 90nm CELL / 90nm RSX / GS+EE Chip



COK-002: CECHC (60Gb), CECHE (80Gb): 90nm CELL / 90nm RSX / GS chip



SEM-001: CECHG (40Gb): 65nm CELL / 90nm RSX



DIA-001: CECHH (40Gb): 65m, CELL / 65nm RSX



Size comparison, COK-001 Vs DIA-001:



There are several different new 80Gb model numbers planned (CECHJ, CECHK, CECHL. CECHM), so it seem that there are more mobo revisions to come. Maybe some of the later ones such as CECHM will have 45nm CELL.



BKK2 on 15 September 2008

Here we can see the different heatsinks for 1st generation (90nm CELL / 90nm RSX), 2nd generation (65nm CELL / 90nm RSX), and 3rd generation (65nm CELL / 65nm RSX) mobos:



Furukawa Electric Co Ltd exhibited a new heat sink for the PlayStation 3 (PS3), a game console developed by Sony Computer Entertainment Inc (SCE), at Techno-Frontier 2008. The exhibition took place from April 16 to 18, 2008, at Makuhari Messe in Chiba Prefecture, Japan.
The company defines the first heat sink mounted in the PS3, which was released in November 2006, as the first-generation product. And it already begun commercial production of the third-generation heat sink for the PS3. The third-generation product is characterized by its small size, light weight and low cost.

The heat sink developed by Furukawa Electric is used to cool the microprocessor "Cell" and graphics LSI "RSX." When Nikkei Electronics Teardown Squad disassembled the PS3 in November 2006, this heat sink, together with a large cooling fan whose diameter is more than 13cm, drew its attention (See related article).


The PS3, at first, is equipped with the Cell produced in 90nm process technology. But it was replaced with the Cell produced in 65nm process technology to reduce the cost and power consumption. Along with this change, Furukawa Electric reduced the size, weight and cost of the heat sink by, for example, decreasing the number of its components each time its generation changed.


Especially, the shift from the second generation to the third was drastic. In the first and second-generation products, a large heat sink cooled both the Cell and RSX. But they are cooled by separate heat sinks in the third-generation product.


Furthermore, copper heat pipes, which were used in the first- and second-generation heat sinks, are no longer used in the third-generation product. Five and two copper pipes were used in the first- and second-generation products, respectively. Furukawa Electric realized enough heat-radiation performance without using a heat pipe, the company said.


The first-, second- and third-generation products support power consumptions of about 200, 160 and 130-140W, respectively, for both the Cell and RSX.


The kinds of components are more than 20 for the first generation and about 10 for the second. But the third-generation product has only three kinds of components, a fin and pin made by aluminum and a thick aluminum plate used as a substrate. As a result, the weights of the first-, second- and third-generation products are about 700, 500 and 350g, respectively.


Link



Pristine20 on 15 September 2008

I guess obieslut is representing Rock_on in his absence. \

My ps3 just had power problems . I hope this solves the "blinking red light" issue



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