The issue is not the crappy solder at all... it is because the CPU/GPU runs over the ideal temperatue... eletronic solder doesn't support too high temperature.

The design/project of a console (or any eletronic) needs to be make to run cool.

And that's exactly why i'm looking forward to what microsoft has to offer.

ps. They also have created C# which is an awesome programming language. :)

Its a small increase. But how are they still making tweaks to the system? I thought production was supposed to have started already.

Negative? He post only stuffs about MS because he is a MS insider (there are theories about who is he).

Seems like MS have a lot of announces for Gamescom but the announce they are holding for September is even more "WOW".

Side note... somebody in GAF tried to say that CBOAT said about downclock before... he couldn't prove that and the mods give him the profile title "#DEADWRONG"... I think these things a lot fun there .

Well drivers, clock, software related can be make with Day One patch... colling system, memory size, yelds, silicon related not.

Oh wow, I didn't know that. 

Didn't he call 360 owners Xbots the other day?

I don't know... Is Xbots an offence? Some guys here said Xbone/Xboners seems like offence too but I think they names are really cool.

In simple terms, if you want higher speeds, you need to provide more current per time unit to the transistors. Simplified, you want 6% higher speed, you need 6% more current (which is done by increasing the driving force, the voltage). Now if you looked into your old physics book, you would find that the heat to dissipate over your resistors goes like P = I^2 * R. So contrary of what you think, heat dissipation "goes worse" with clock rate increase. AMD stuff had a tendency to go through the roof rather early (compared to Intel chips) at some clock rate. This was improved and AMD can go around 1GHz without excessive heat production. Again the key word here is "excessive" (check a 7970 for heat dissipation), the 53MHz clock rate increase does increase the heat output noticably.

The second misconception is the assumption that "larger box = better cooling". This is wrong, as larger volume always means "possibility to have dead air space". So it is actually more difficult to cool stuff in a large box than to cool the same stuff in a small box (if done correctly). What always wins is good airflow within your box, irregardless of size. With "simple" consoles like XBox One/PS4 (it basically has only one major, but very localized, heat source, the APU), so designing a reasonable cooling system wasn't that difficult for either company. MS chose to go large box because it wants it to look like a cool Hifi component, and could then incorporate a "huge" fan as a freebie, pretty much noiseless until your game goes into overdrive..

I wonder who figured out the 853MHz, though. Why that odd number? Or maybe the guy who posted it simply mistook an engineering test ("we could run the APU consistent at 853MHz" in the lab) as a sign that end user consoles run at 853MHz?

Notice that for a company that told everyone who wanted (or not wanted) to hear that "it is not about the specs, it is all about the software", it is rather strange that they are fiddling with exactly those specs so late in the development cycle. Actually, we might already in the production phase so I wonder who made the long term test with increased clock rates...

Yes the production should have already started. But that does not mean those units being produce are ready to be sold. Software and drivers are not related to the physical production and they will be installed on produced units much closer to the release date.