The specs of the HMC memory come into finalization phase
Written by Leo D. | April 03, 2013 at 19: 30
As we said you yesterday, the end of Moore's law is close, at least for AMD and, to a lesser extent, its head of architecture GPU John Gustafson. But there are many ways to consider the future, as for example, processors manufactured by successive layers, there where there is for current processors as a 2D surface. The interest is that it becomes possible to multiply the cores easily, and all the more simple to connect them together.
That a possible pathway for research, to continue to increase the performance of the processors, it is possible that this is not the CPU that were the first to make the jump to the tridimension. Indeed, the HMCC or Hybrid Memory Cube Consortium, which includes heavyweights such as Samsung, Hynix, Micron and Microsoft, but also the members count as ARM, HP and IBM as well as Xilinx and Open-Silicon, has released version 1 of the specifications of the eponymous memory (HMC therefore), with a little delay since the deadline of the consortium had previously been set at end 2012.
It is therefore a real step towards the commercialization of such RAM modules. Their structure is similar to the hypothetical 3D processors: it's stacked layers with each other and connected between them, here with a technology called TSV for Through-Silicon Vias ("routes through the Silicon").
Micron had already demonstrated one of his prototypes in 2012, a memory that spouted from 128 GB/s, ten times more than what is able to DDR3. But it wasn't his only advantage: it also consumed 70% less energy during a data transfer, obviously, what did turn some heads on the side of manufacturers of mobile machines. But given prices inherent in this technology, Micron had said at the time apply mainly to the High Performance Computing (HPC).
http://www.microsofttranslator.com/bv.aspx?from=fr&to=en&a=http%3A%2F%2Fwww.comptoir-hardware.com%2Factus%2Fram%2F20954-les-specs-de-la-memoire-hmc-entrent-en-phase-de-finalisation.html