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Forums - Microsoft - Oh No New 360S Still Uses The Old X Clamp On Chipset

Not sure the X clamp was the cause rather it was part of the cure but hey ho whatever floats the guys boat. Otherwise a very impressive list.



W.L.B.B. Member, Portsmouth Branch.

(Welsh(Folk) Living Beyond Borders)

Winner of the 2010 VGC Holiday sales prediction thread with an Average 1.6% accuracy rating. I am indeed awesome.

Kinect as seen by PS3 owners ...if you can pick at it   ...post it ... Did I mention the 360 was black and Shinny? Keeping Sigs obscure since 2007, Passed by the Sig police 5July10.
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RAZurrection said:

The X-clamp is actually a fine design for holding the chipset in place, it was the heat that caused the flexing in the launch models that were the problem. X-clamps are perfectly servicable for a single chip at 45nm

Please refrain from trying to educate them, that is not the reason why such articles are posted.



W.L.B.B. Member, Portsmouth Branch.

(Welsh(Folk) Living Beyond Borders)

Winner of the 2010 VGC Holiday sales prediction thread with an Average 1.6% accuracy rating. I am indeed awesome.

Kinect as seen by PS3 owners ...if you can pick at it   ...post it ... Did I mention the 360 was black and Shinny? Keeping Sigs obscure since 2007, Passed by the Sig police 5July10.
jneul said:

ouch this can be a really, really bad, whose idea was this??

edit: what i mean people will get confused and associate the xclamp's with failure's

What people I wonder?  Who looks at this before buying one?  I'm pretty sure nobody...

On topic, they released here today at Game Stop (San Antonio, TX) and are sold out all over town.  This is NOT to claim that they are sold out ALL OVER THE WORLD!!  Just saying that I would've picked one up today, but Best Buy doesn't have them yet and all Game Stops are sold out.



So wait...do the newer "old" style 360's use this X-clamp as well?  Or was it just the first models?  If it's the latter, and given we know the "new" 360 uses the same crappy disk drive as before, are this models actually just repackaging of old parts?  I'm sure that might not be likely, but do we have comfirmation on what type of chipset these new models use? 



thismeintiel said:

So wait...do the newer "old" style 360's use this X-clamp as well?  Or was it just the first models?  If it's the latter, and given we know the "new" 360 uses the same crappy disk drive as before, are this models actually just repackaging of old parts?  I'm sure that might not be likely, but do we have comfirmation on what type of chipset these new models use? 


Ok i'll break it down.

All Xbox 360s use X-clamps to hold the CPU/GUP heat sinks firmly to the motherboard.

The first 11 million or so Xbox 360s had the largest chips and therefor, the hottest. With heat, the board and it's parts would flex. Even assuming a thorough gaming session weekly would only flex the board 0.1mm a week, that's still 5CM a year. Thus over a year or more, the firm hold of the x-clamp started to become less firm, after a certain amount of slack an xbox 360 will RRoD (1 or 3 lights usually)

This is why some launch models took anywhere from 3 weeks to 3 years to rrod, it was all a gradual erosion. It is also why performing an "X-clamp fix" can fully fix a RRoD 360, because it reaffirms the firm hold (using nuts and bolts) to the mo-bo.

Any way, in 2007 Microsoft released a smaller CPU, then a year later a smaller GPU, then 18 months later an even smaller CPU/GPU hybrid.

The smaller the chips got, the less the internal heat.

The less heat, the less flexing.

The less flexing...the firmer the hold of the X-clamp

This is why RRoD became an ever decreasing issue, partly with the first chip shrink and almost entirely by the time the system chips were both 65nm. These current models are even better, plus as it's a single chip now, theres less chance of either a CPU or GPU acting up, it's all one and the same.

 



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kowenicki said:

glossy is a disadvantage?  its a bonus as far as I am concerned.

 

I like my glossy ps3 and i will like my new glossy 360.

 

faceplates??? meh... shite.

 

its a cry baby list of whining.

this. wtf is up with that article ?



I do avoid glossy on dark handhelds (or rather, the other way around), but who is cuddling a home console to an extent to have fingerprints as a common occurance?

Dust is another thing though, it's more visible... but a feather duster is not made out of fingers.



RAZurrection said:
thismeintiel said:

So wait...do the newer "old" style 360's use this X-clamp as well?  Or was it just the first models?  If it's the latter, and given we know the "new" 360 uses the same crappy disk drive as before, are this models actually just repackaging of old parts?  I'm sure that might not be likely, but do we have comfirmation on what type of chipset these new models use? 


Ok i'll break it down.

All Xbox 360s use X-clamps to hold the CPU/GUP heat sinks firmly to the motherboard.

The first 11 million or so Xbox 360s had the largest chips and therefor, the hottest. With heat, the board and it's parts would flex. Even assuming a thorough gaming session weekly would only flex the board 0.1mm a week, that's still 5CM a year. Thus over a year or more, the firm hold of the x-clamp started to become less firm, after a certain amount of slack an xbox 360 will RRoD (1 or 3 lights usually)

This is why some launch models took anywhere from 3 weeks to 3 years to rrod, it was all a gradual erosion. It is also why performing an "X-clamp fix" can fully fix a RRoD 360, because it reaffirms the firm hold (using nuts and bolts) to the mo-bo.

Any way, in 2007 Microsoft released a smaller CPU, then a year later a smaller GPU, then 18 months later an even smaller CPU/GPU hybrid.

The smaller the chips got, the less the internal heat.

The less heat, the less flexing.

The less flexing...the firmer the hold of the X-clamp

This is why RRoD became an ever decreasing issue, partly with the first chip shrink and almost entirely by the time the system chips were both 65nm. These current models are even better, plus as it's a single chip now, theres less chance of either a CPU or GPU acting up, it's all one and the same.

 

You forgot to mention solder whiskers, and the issues of inexperience with lead free solder causing systemic issues in BGA designs at that time (including the PS3 hence the YLOD issues with the 60GB).  That being said its a good summary that will subsequently be ignored by the large number of Sony fans trolling these boards.  As you say the xclamp design has been fine for over a decade in other appliances, the issue is more to do with manufacturing and the cooling design than anything else.



Dang!  people will find any way possible to hate lol.



don't the X clamps just hold the chipset in place?

i thought the main problem was the heat syncs being faulty and prone to shorting out.