1) You will need to provide a citation of those systems with an AMD APU with dedicated graphics memory.
2) You can modify a BIOS.
1) I don't need to. You are purposely deviating from what I meant at the beginning, and going full circle. So there is not point. You are only focused in consumer platforms for PC. Enterprise platforms and custom platforms solutions are different.
2) I Already said so.
3) Not profiles. ID tags so they can be identified just like CPU codes are verified during boot by the BIOS, currently this is non-existent. RAM sticks use a FPGA controller for compatibility based on the NAND speed and socket target. If given and id tag or code, it will probably provoke costs to go way higher with the testing across infinite devices, wil require new socket profiles/pinouts for the ID module integration and it will not provide any real benefit to the standard consumer. RAM sticks are built based on specifications. The motherboards(bios) usually just check if the ram complies with those, and adjust timing accordingly, after 1st boot.
Like you said earlier, if you don't give a shit, why should I? Move on.
Going back to the main topic, there were rumors about PS5 overheating. While the rumors are probably fake (Jeff Rickel) I will be neutral on this just to be fair for the sake of the argument. Accordingly to Cerny, the way PS5 is being built is with a specific power level that will be linear to the capabilities to the cooling solution, reducing drastically the thermal load spike under heavy processing that occurs in ordinary platforms, by changing the frequency and not the voltage. By having an specific power level, the cooling solution will work as intended in all game scenarios independently from workload they can provoke. At least he was very clear in that aspect and while he hasn't revealed yet the cooling solution, if memory serves me right he mentioned that it was also to maintain the system as silent possible preventing the fan speed from changing so much. In addition to that there were reports from the stock market analysts, stating that the cooling solution selected for the PS5 was more robust and costlier than previous consoles. With the PS5 specs already revealed, the cooling solution surely was designed entirely to manage such high frequencies in the RDNA2 architecture. The only aspect that could be giving Sony a problem is the additional heat coming from the SSD solution, while it can be true I don't really think it would be such hurdle. If SSD is really increasing heat inside the console, then it just need to be relocated or isolated. Another way is to add heatsinks and use a separate airflow for it, nothing special or complicated for a company as Sony. So, in my opinion the rumor is just utterly nonsense to me.Last edited by alexxonne - on 04 April 2020