haxxiy said:
10-12 TF is indeed very feasible for the power envelope of a console on 7 nm. However, I'm slightly concerned with profitability at $399 since the cost per mm2 on a chip is increasing with every die shrink. A 300 mm2 chip on 7 nm might cost as much as a 400 mm2 chip on 14 nm, and Zen-like cores are huge, about 11 mm2 on 14 nm versus ~3 mm2 for the Jaguars on the same node. Of course, I'm sure the folks at Sony and AMD are very aware of that and might be coming up with smart solutions that doesn't involve scaling down their next generation console way too close to the XOX and even the PS4 Pro for comfort. Maybe even two smaller separate dies on the same lid - say, a 100 mm2 CPU and a 200 mm2 GPU - is going to be cheaper than a single 300 mm2 design. AMD already has a similar technology on Infinity Fabric to make it work like a single die. |
Don't forget the next gen starts with a projection of selling 60 to 100 million consoles with that tech, instead of a projected 5 to 10 million for a mid gen refresh. R&D costs can be recouped much faster and production costs scaled down much faster on the next base console, meaning a slight loss at release won't be a problem. Mid gen refreshes need to be close to cost as they don't bring many new customers into the eco system.