megafenix said:
pfff, dude you should read what you post
Coming from you, eh ?
TSMC manufacturing the edram, really?
No duh, who else can do it other than global foundries ? Where the hell do you think these VLSI ICs come from ?
here
http://www.dualshockers.com/2013/08/04/nintendo-and-the-wii-u-may-be-in-trouble-due-to-closure-of-vital-semiconductor-factory/
"
Nintendo and the Wii U May Be in Trouble due to Closure of Vital Semiconductor Factory
by Giuseppe Nelva on August 4, 2013 4:19 AM
There may be more trouble on the horizon for the already slow-selling Wii U. On Friday the prominent semiconductor manufacturer Renesas Electronics posted its quarterly financial report, together with notice of extraordinary loss and a press release about an impending restructuring of the company.
As part of that restructuring Renesas, that merged with NEC Electronics in 2012, announced that it decided to close four semiconductor plants in Japan within 2-3 years, including the state-of-the-art factory based in Tsuruoka, Yamagata Prefecture (as reported by the Wall Street Journal), and this may spell trouble for Nintendo and the Wii U.
The reason is quite simple. The closing factory was responsible for manufacturing the console’s Embedded DRAM, that is quite properly defined the “life stone” of the console.
Nintendo told the Japanese Magazine Weekly Diamond that “the closure of the plant won’t have immediate effects on the production of the Wii U”, but the outlook of things isn’t too positive for the future.
Nintendo could try to contract another company to produce the component, but there are circumstances that make it difficult. According to a Renesas executive the production of that semiconductor was the result of the “secret sauce” and state-of-the-art know-how part of the NEC heritage of the Tsuruoka plant, making production elsewhere difficult. In order to restart mass production in a different factory redesigning the component may be necessary.
"
That's a worthless article ... We don't even have a PR statement from Renesas claiming that it was due to low console sales.
except wasnt 256GB/s?
really?
here
http://www.beyond3d.com/content/articles/4/3
"
The one key area of bandwidth, that has caused a fair quantity of controversy in its inclusion of specifications, is that of bandwidth available from the ROPS to the eDRAM, which stands at 256GB/s.
"
Interconnect bandwidth means jack shit ... What's most important is main memory bandwidth. It is the DRAM that bridges the gap, not eDRAM.
or as the article from gaming blend says, here
http://siliconvalleywriting.com/Bob%20Peterson%20sample_Embedded%20DRAM%20for%20Xbox%20360.pdf
"
As Xbox Product Group corporate vice president Todd Holmdahl explains, “Without NEC Electronics embedded DRAM on the GPU and the huge 256-Gbytes/second dedicated bus from the GPU core to the eDRAM, it is impossible to render true next-generation scene complexity at high-resolution with anti-aliasing.” Xbox 360 supports all games with this dramatic performance in high definition TV at 16:9, 720p and 1080i. A look at the GPU shows why it needs such an outrageous memory bandwidth.
The 500-MHz custom ATI graphics processor—fabricated by NEC Electronics—includes 48-way-parallel floating-point dynamically scheduled shader pipelines and a unified shader architecture. Using external memory, the GPU would be limited to a 32- or 64-bit interface. The NEC Electronics eDRAM expands the on-chip memory interface past 1000 bits in width to support the GPU’s 256-Gbytes/second bandwidth between the graphics pipelines and memory.The 10-Mbyte eDRAM block consists of several 20-Mbit macros, each capable of supporting 500-MHz clock speeds. The macro was developed by NEC Electronics, and it offers versatile design parameters for easy integration with other intellectual property (IP).
"
Ok the first thing that marketing got wrong is that's between the ROPS and eDRAM. The second thing is that it's 32 GB/s between the eDRAM and GPU.
or even here(page 5)
http://meseec.ce.rit.edu/551-projects/spring2013/2-3.pdf
or from ign
http://www.ign.com/articles/2005/05/20/e3-2005-microsofts-xbox-360-vs-sonys-playstation-3?page=3
Thanks for the worthless links ...
"
Bandwidth
The PS3 has 22.4 GB/s of GDDR3 bandwidth and 25.6 GB/s of RDRAM bandwidth for a total system bandwidth of 48 GB/s.
The Xbox 360 has 22.4 GB/s of GDDR3 bandwidth and a 256 GB/s of EDRAM bandwidth for a total of 278.4 GB/s total system bandwidth.
"
Thanks for major nelson marketing ...
didnt you read the full article?
Do I have to when i know where your going and you still don't get it ?
here
 uff
Only the ROPS have full access to the edram 256GB/s of bandwidth(as byond3d explained) casue the rops and the edram are both on the same die chip, only the GPU is on a different die chip so it has to communicate with the edram with an external bus of 32GB/s, but since the edram+rops main use is for framebu tffer it doest give that much bottleneck. As for wii u, the whole gpu and the edram are in the same die chip, menang that wii u gu has full access to the edram bandwidth
@Bold No
Thanks for owning youself. The only way to get higher bandwidth is to either blow it on a bigger memory controller or increase the memory clocks.
edram bandwidth and latecy isnt important for teselation and displacement?
seriously, have you even read the article or only the title?
here(pages 10,16,,17,42, 43,73,80, 94, 95,)
http://www.graphics.stanford.edu/~niessner/papers/2013/thesis/niessner2013thesis.pdf
Don't you dare go about questioning one of the more experienced in the master race. This is the exact reason why you got banned on beyond 3D for spouting shit like this. eDRAM bandwidth means jack shit for tessellation performance. Tessellation is dependent on GEOMETRY ENGINES.
seriously dude, just read
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