fatslob-:O said:
Yeah, you are a liar ... What does info about the xbox 360 have to do with the WII U ? How are they made by the same guys when the xbox 360's eDRAM was designed by the guys at NEC Electronics and the WII U's eDRAM was designed by Renesas Electronics ? (See this is another one of your lies again.) What NEC plant LOL ? It's manufactured by TSMC. Do you even know what your talking about ? I want to know shin'en's EXACT WORDS, not some sprinkled up shit that you made up. Except it WASN'T 256 GB/s so get that through your thick skull and stop lying. What Sony said was a god damned EXAMPLE, not an actual implimentation that they were aiming for. Tessellation performance has absolutely NOTHING to do with the interconnect bandwidth of eDRAM. Jesus, the rest of your post makes me laugh about your explanation on the mechanics of tessellation. You haven't the slightest clue as to how tessellation works. |
pfff, dude you should read what you post
TSMC manufacturing the edram, really?
here
"
Nintendo and the Wii U May Be in Trouble due to Closure of Vital Semiconductor Factory
There may be more trouble on the horizon for the already slow-selling Wii U. On Friday the prominent semiconductor manufacturer Renesas Electronics posted its quarterly financial report, together with notice of extraordinary loss and a press release about an impending restructuring of the company.
As part of that restructuring Renesas, that merged with NEC Electronics in 2012, announced that it decided to close four semiconductor plants in Japan within 2-3 years, including the state-of-the-art factory based in Tsuruoka, Yamagata Prefecture (as reported by the Wall Street Journal), and this may spell trouble for Nintendo and the Wii U.
The reason is quite simple. The closing factory was responsible for manufacturing the console’s Embedded DRAM, that is quite properly defined the “life stone” of the console.
Nintendo told the Japanese Magazine Weekly Diamond that “the closure of the plant won’t have immediate effects on the production of the Wii U”, but the outlook of things isn’t too positive for the future.
Nintendo could try to contract another company to produce the component, but there are circumstances that make it difficult. According to a Renesas executive the production of that semiconductor was the result of the “secret sauce” and state-of-the-art know-how part of the NEC heritage of the Tsuruoka plant, making production elsewhere difficult. In order to restart mass production in a different factory redesigning the component may be necessary.
"
except wasnt 256GB/s?
really?
here
http://www.beyond3d.com/content/articles/4/3
"
The one key area of bandwidth, that has caused a fair quantity of controversy in its inclusion of specifications, is that of bandwidth available from the ROPS to the eDRAM, which stands at 256GB/s.
"
or as the article from gaming blend says, here
http://siliconvalleywriting.com/Bob%20Peterson%20sample_Embedded%20DRAM%20for%20Xbox%20360.pdf
"
As Xbox Product Group corporate vice president Todd Holmdahl explains, “Without NEC Electronics embedded DRAM on the GPU and the huge 256-Gbytes/second dedicated bus from the GPU core to the eDRAM, it is impossible to render true next-generation scene complexity at high-resolution with anti-aliasing.” Xbox 360 supports all games with this dramatic performance in high definition TV at 16:9, 720p and 1080i. A look at the GPU shows why it needs such an outrageous memory bandwidth.
The 500-MHz custom ATI graphics processor—fabricated by NEC Electronics—includes 48-way-parallel floating-point dynamically scheduled shader pipelines and a unified shader architecture. Using external memory, the GPU would be limited to a 32- or 64-bit interface. The NEC Electronics eDRAM expands the on-chip memory interface past 1000 bits in width to support the GPU’s 256-Gbytes/second bandwidth between the graphics pipelines and memory.The 10-Mbyte eDRAM block consists of several 20-Mbit macros, each capable of supporting 500-MHz clock speeds. The macro was developed by NEC Electronics, and it offers versatile design parameters for easy integration with other intellectual property (IP).
"
or even here(page 5)
http://meseec.ce.rit.edu/551-projects/spring2013/2-3.pdf
or from ign
http://www.ign.com/articles/2005/05/20/e3-2005-microsofts-xbox-360-vs-sonys-playstation-3?page=3
"
Bandwidth
The PS3 has 22.4 GB/s of GDDR3 bandwidth and 25.6 GB/s of RDRAM bandwidth for a total system bandwidth of 48 GB/s.
The Xbox 360 has 22.4 GB/s of GDDR3 bandwidth and a 256 GB/s of EDRAM bandwidth for a total of 278.4 GB/s total system bandwidth.
"
didnt you read the full article?
here
uff
Only the ROPS have full access to the edram 256GB/s of bandwidth(as byond3d explained) casue the rops and the edram are both on the same die chip, only the GPU is on a different die chip so it has to communicate with the edram with an external bus of 32GB/s, but since the edram+rops main use is for framebu tffer it doest give that much bottleneck. As for wii u, the whole gpu and the edram are in the same die chip, menang that wii u gu has full access to the edram bandwidth, this sounds logical cause the edram wasnt designed just for framebuffer but also for textures, zbuffer and vertex texture fetch data(already agmecube used embedded memory for both framebuffer, zbuffer and textures so this comes as no surprise)
edram bandwidth and latecy isnt important for teselation and displacement?
seriously, have you even read the article or only the title?
here(pages 10,16,,17,42, 43,73,80, 94, 95,)
http://www.graphics.stanford.edu/~niessner/papers/2013/thesis/niessner2013thesis.pdf
seriously dude, just read
