drkohler said:
With that cooler in the XBox One, they could probably cool 1000GBytes of ram without risking rrod2 , so the problem is not getting rid of the additional heat (though ddr3 chips are more probematic than gddr5 chips, by design). The problems are simply in the engineering department: 1. How do you add 4GB ddr3 ram onto a 256bit bus (they come in *16bit widths max) ? 2. Can your APU drive the additional memory? 3. Did you order enough dram chips or are you willing to pay spot market prices because you didn't order enough? Some things can be solved with lots of cash (though I doubt MS wants to lose too much money on hardware), some other thing might require months of testing - time MS simply doesn't have. |
The cheapest and easiest solution to that problem is to add an extra 8GB.
I was merely hoping you would enlighten others to the fact that RROD was a a systemic fault with the design of the original 360 board and a lack of understanding on the ramifications of moving to lead free solder. Had the board been thicker the issue wouldn't have occurred. It had nothing to do with any changes to memory or a rush to market and everything to do with inexperience of lead free solder. Not surprisingly most companies suffered including the likes of Nvidia and most motherboard manufacturers (especially notebooks).
